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DePasse t1_ir4e2r1 wrote on October 5, 2022 at 6:55 AM

Reply to comment by AnacondaPimpHand in Micron’s investing $100 billion to bring the country’s ‘largest semiconductor fabrication facility’ to New York by Avieshek

Following the dicing packaging needs to be done as well. Purely diced dies are not usable as they cannot be integrated into usual electronics without a first level package for most use cases.